exact
NOVAFAB
exact
NOVAFAB
Trademarks matching 'novafab'
Summary of page content
2018-12-18
US
-
1
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
chemicals and electroplating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and electroplating chemicals for wafer level semiconductor packaging processes; chemicals and electroplating chemicals for panel level semiconductor packaging processes; chemicals and electroplating chemicals for fan out wafer level semiconductor packaging processes; chemicals and electroplating chemicals for fan out panel level semiconductor packaging processes; chemicals for use in electroless plating and electroplating processes; metals and polymers for electroless plating and electroplating processes
732
THIRD EXTENSION - GRANTED
2021-01-11
2021-01-13
systems services international solutions technology group industries technologies management associates association design business resources club health communications enterprises data home
2018-12-18
US
-
1
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
chemicals and electroplating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and electroplating chemicals for wafer level semiconductor packaging processes; chemicals and electroplating chemicals for panel level semiconductor packaging processes; chemicals and electroplating chemicals for fan out wafer level semiconductor packaging processes; chemicals and electroplating chemicals for fan out panel level semiconductor packaging processes; chemicals for use in electroless plating and electroplating processes; metals and polymers for electroless plating and electroplating processes
732
THIRD EXTENSION - GRANTED
2021-01-11
2021-01-13
systems services international solutions technology group industries technologies management associates association design business resources club health communications enterprises data home