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Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
oxides and carbides in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of oxides and carbides bonded with oxides and carbides used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics
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Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; non-electric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
titanium aluminum, tungsten titanium, aluminum silicon, aluminum silicon copper, aluminum copper, gold tin, gold germanium, gold nickel, iron hafnium, iron zirconium, cobalt iron tantalum, nickel chromium silicon, and tungsten silicon alloys, cermets, and refractory compounds, namely, refractory blocks of metal, refractory shapes of metal, fired refractory materials of metal in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of metal bonded with titanium aluminum, tungsten titanium, aluminum silicon, aluminum silicon copper, aluminum copper, gold tin, gold germanium, gold nickel, iron hafnium, iron zirconium, cobalt iron tantalum, nickel chromium silicon, and tungsten silicon alloys, cermets, and refractory compounds, namely, refractory blocks of metal, refractory shapes of metal, fired refractory materials of metal used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; precious and semi-precious metals in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of precious and semi-precious metals bonded with precious and semi-precious metals used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics